Tecnisco

Japan

overview

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation’s cutting and grinding technologies. Since then, TECNISCO have developed and integrated our technology fields into a “Cross-edge” micro processing technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.

 

Product list

Metal products

 

Metal diamond composites (Silver diamond)
Silver based diamond composites for advanced thermal management

Metal diamond composites

this material features an excellent thermal conductivity and a relatively low thermal expansion that no past materials were capable of.  long-lasting, reliable material beneficial for high power applications.

Microchannel cooler

Microchannel cooler

New-structured microchannel heat sink leading to a longer life of the high power LD module
new-structured microchannel heat sink which gives the high power LD module a longer life. Complement effect between Cu and Mo and technology of inside channels make it low electric-resistant and CTE-matched with LD. Au coating on the inside of the channels results in the improvement in corrosion prevention.

High pressure Seamless microchannels

High pressure Seamless microchannels

Original method of forming microchannels in single solid metal resulting in high pressure-resistance microchannels
most reliable high pressure-resistance microchannel product, microchannels in the single solid metal. The inside channels are completely coated by Au coating, leading to the improvement of corrosion-resistance. Thus, it can be used as an efficient thermal conductor with liquid/gas circulating inside. Also, it can be used a mixing device or analytical device in the biotechnology/medical industries by taking advantage of the high-pressure resistance.

Insulation type Cu-AlN-Cu submount

Insulation type Cu-AlN-Cu submount

Cu-AlN-Cu composite-type submount with high thermal conductivity leading to the decrease in thermal stress to LD. Insulation type
This is a heat sink for high-power LD (Laser diode) modules. Three-layer composition achieves both high thermal conductivity and insulation quality. Control of Cu plating thickness makes the heat sink match with the LD, resulting in higher power and longer life of the LD module. Because pullback is not required on the critical edge area, it has a high degree of freedom in designing. Moreover, it can be applied to a variety of application by this freedom in design.

CuW submount

CuW submount

Heat sink with high electric conductivity leading to the increase in the LD module power
This CuW submount is used as a heat sink for high power LD modules. Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area

 

Mounts / Carriers

Mounts / Carriers

With our “ Cross-edge ” technology, any type of carrier can be manufactured according to the customers’ requirements
Any type of carriers from C-mount to full-customized carriers can be manufactured according to the customers’ requirements. Our “ Cross-edge ” technology including cutting, plating, vapor deposition, and bonding, gives you a one-stop solution.

 

Glass products

 

 

Through glass via (TGV)

Through glass via (TGV)

Most suitable for miniaturizing semiconductor devices. The metal via can improve the high-frequency properties of the devices

Micro-hole glass

Micro-hole glass

Leads to the miniaturization of devices in combination with semiconductors/electronic parts

Cavity glass
/ Cap glass

Cavity glass / Cap glass

Hi-precision cavity can be formed inside of the glass wafer. Transparent and thinner finish is available on the cavity bottom

Mesh glass

Mesh glass

Can be used as general-purpose via wafers with the holes plated to form electrodes. Also suitable for cell-culture systems.

Spacer glass

Spacer glass

Suitable for multilayer packaging by combining with semiconductor wafers such as MEMS devices.

Microfluidic glass

Microfluidic glass

Microfluidic glass products with excellent thermal and chemical resistance. The microfluidic channels can be flexibly designed in 3 dimensions.

Silicon products

Silicon products

Highly-reliable silicon products realized by “Cross-edge” technology and quality assurance system

Silicon products

CVD susceptors,
Rings for various equipment
Focus rings Cleaning jigs
Wall plates in the implantation dome Tubes Pins
Optical waveguide wafer jigs for various devices Tables Nozzles

Silicon wafer for dicing test

We sell silicon wafers for pre-dicing, experiment and evaluation purposes.

“Cross-edge” technology

3D Glass Mettalization
3D配線基板

Form a wiring on the three-dimensional shape is available for downsizing, weight reducing to achieve high performance of electronics

HY Method
HY製品

Micro rectangle through holes with Mesh glass

Si+Glass wafer
Si+Glass一体基板

Glass area has mirror finished surface
Transmittance is same as original Borofloat 33
Possible to use as insulating and/or light sheild material

TGV
(Cu-Via)

TGV(CuめっきVia)

TGV with filled Cu makes it possible to minimize device
Glass surface has mirror finished quality and transmittance is same as original Borofloat 33

 

Metal products

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